Low temperature flexible die attach adhesive and articles using

Details Low temperature flexible die attach adhesive and articles using Low temperature flexible die attach adhesive and articles using

1992-05-28

1993-10-05

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524381, 524382, 524440, 528361, 528362, 528363, 528422, C08K 506

Patent

active

052506002

ABSTRACT:
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

REFERENCES:
patent: 4552690 (1985-11-01), Ikeguchi
patent: 5150195 (1992-09-01), Nguyen
Hans Steinegger, "Smart Cards: Bonding Technology at Its Limits," Microelectronics Manufacturing Tech., Dec. 1992, pp. 13-15.
Andrew Rosenbaum, "Smarter and Smarter," Electronics, Oct. 1991, 32D & 32E.
Daniel Webb, "What Future is in the PC Cards?", Electronic Business, Nov. 4, 1991, p. 11.
Article on "Japan challenges Intel's lead in flash memories," attached chart "World EPROM Market", Semiconductors.

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