Compositions – Electrically conductive or emissive compositions
Reexamination Certificate
2006-07-18
2008-12-02
Kopec, Mark (Department: 1796)
Compositions
Electrically conductive or emissive compositions
C219S543000, C219S466100, C423S625000, C427S314000, C428S209000, C252S510000, C252S514000
Reexamination Certificate
active
07459104
ABSTRACT:
A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film heating elements, as lead is often used in thick film formulations to allow the glass-based thick film to be processed at low firing temperatures. Using composite sol gel technology, the present invention provides a method to produce a lightweight mica-based thick film heating element based on thick film materials that are free from lead or cadmium. This mica-based element is lightweight, has the performance advantages of a thick film heating element, and may be processed at a low temperature using thick film materials. Particularly, the present invention provides a lightweight heating element comprised of a mica-based substrate material, a resistive thick film that can be produced by composite sol gel technology, optionally a conductive thick film which is used to make electrical connection to the resistive element, and optionally a topcoat which is used to provide protection against moisture and oxidation. This element is lightweight, provides efficient, rapid heat up and cool down, can be designed to provide even temperature distribution, and delivers power at lower operating temperatures resulting in increased element safety.
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Barrow David Andrew
Olding Timothy Russell
Ruggiero Mary Ann
Datec Coating Corporation
Hill & Schumacher
Kopec Mark
Nguyen Khanh Tuan
Schumacher Lynn
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