Low-temperature fired ceramic circuit substrate and thick-film p

Details Low-temperature fired ceramic circuit substrate and thick-film p Low-temperature fired ceramic circuit substrate and thick-film p

1996-02-26

1997-09-09

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 361798, 252514, 501 2, B32B 900

Patent

active

056654596

ABSTRACT:
A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800.degree. and 1,000.degree. C. includes a plurality of insulating layers each formed of a low-temperature fired ceramic, an Ag conductor layer formed internally of the substrate, an Au conductor layer formed on a surface of the substrate, and an Ag--Pd layer formed between the Ag and the Au conductor layers, the Ag--Pd layer being composed of 100 parts metal composition consisting of 70 to 95 parts Ag and 5 to 30 part Pd by weight, and 2 to 10 parts lead borosilicate glass by weight. As the result of the above composition of the ceramic circuit substrate, its fabrication process can be simplified, and a defect rate in a connection between the Ag and Au layers after repeated firing is rendered approximately zero, which ensures high reliability for the connection.

REFERENCES:
patent: 3891450 (1975-06-01), Trease
patent: 4424251 (1984-01-01), Sugishita
patent: 4464420 (1984-08-01), Taguchi
patent: 4621066 (1986-11-01), Nishigaki et al.
patent: 4795670 (1989-01-01), Nishigaki

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