Low temperature, fast curing silicone compositions

Details Low temperature, fast curing silicone compositions Low temperature, fast curing silicone compositions

2005-01-04

2005-01-04

Peng, Kuo-Liang (Department: 1712)

Stock material or miscellaneous articles

Composite

Of silicon containing

C427S387000, C528S012000, C528S015000, C528S019000, C528S024000, C528S025000, C528S029000, C528S031000, C528S032000, C524S430000, C524S588000, C525S478000

Reexamination Certificate

active

06838182

ABSTRACT:
Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

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