Low temperature deposition and ultra fast annealing of...

Semiconductor device manufacturing: process – Making passive device – Planar capacitor

Reexamination Certificate

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C257SE21015, C257SE21021

Reexamination Certificate

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08003479

ABSTRACT:
Some embodiments of the invention include thin film capacitors formed on a package substrate of an integrated circuit package. At least one of the film capacitors includes a first electrode layer, a second electrode layer, and a dielectric layer between the first and second electrode layers. Each of the first and second electrode layers and the dielectric layer is formed individually and directly on the package substrate. Other embodiments are described and claimed.

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