Low-temperature curing resin system

Details Low-temperature curing resin system Low-temperature curing resin system

1994-06-01

1995-08-29

Sluby, P. C.

Stock material or miscellaneous articles

Composite

Of epoxy ether

428407, 428408, B32B 2738

Patent

active

054458897

ABSTRACT:
A resin system includes 100 parts by weight of an epoxy resin, from about 1/2 to about 10 parts by weight of an imidazole curing agent, and, optionally, an elastomeric material such as a rubber. The resin system without the elastomer is particularly useful as the matrix of a composite material or a potting compound, and the resin system with the elastomer is particularly useful as an adhesive. The resin system is cured at a low temperature and exhibits essentially no dimensional instability upon curing, and then is preferably post-cured at a higher temperature. The post-cured resin system has a softening temperature substantially higher than the normal post-cure temperature and has good mechanical properties.

REFERENCES:
patent: 3989673 (1976-11-01), Jenkins et al.
Sheng Yen Lee, "Thermomechanical Properties of Polymeric Materials and Related Stresses", SAMPE Quarterly, pp. 48-51 (Apr. 1990).
D. A. Saravanos et al., "Concurrent Tailoring of Fabrication Process and Interphase Layer to Reduce Residual Stresses in Metal Matrix Composites", SAMPE Quarterly, pp. 36-44 (Jul. 1991).
Barbara F. Howell, "Influence of Expanding Monomer on Carbon Fiber Reinforced Epoxy Composites", Report DTRC-SME-90/20, David Taylor Research Center (Jun. 1990).

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