Low temperature curing resin system

Details Low temperature curing resin system Low temperature curing resin system

1974-12-30

1976-11-02

Pertilla, Theodore E.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 2N, 260 37EP, 428444, C08G 3014

Patent

active

039896730

ABSTRACT:
A new system of epoxy resins and curing agents is disclosed which may be cured at low temperatures to yield polymeric materials capable of providing excellent binders for filled systems. The new combination exhibits a useful pot life, and cures at low temperatures to form a tough, dimensionally stable polymer.

REFERENCES:
patent: 3438937 (1969-04-01), Christie
Handbook of Epoxy Resins Lec & Neville, 1967 (pp. 9-9 thru 9-10;10-17).

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