Coating processes – With post-treatment of coating or coating material – Heating or drying
Patent
1985-01-07
1986-05-20
Page, Thurman K.
Coating processes
With post-treatment of coating or coating material
Heating or drying
427389, 427391, 427392, 427393, D02G 300, B05D 302
Patent
active
045901023
ABSTRACT:
A nonwoven substrate impregnated with a vinyl acetate/ethylene/N-methylolacrylamide or vinyl chloride/ethylene/N-methylolacrylamide copolymer emulsion binder is cured by employing an acidic substance having a pKa of 1 to 2, sufficiently drying to volatilize a substantial amount of the water while not substantially cross-linking the copolymer binder and maintaining the dried nonwoven substrate at a temperature less than that for drying for a time sufficient to develop essentially full cure.
REFERENCES:
patent: 3380851 (1968-04-01), Lindemann et al.
patent: 3787232 (1974-01-01), Mikotalvy et al.
patent: 4051278 (1977-09-01), Democh
patent: 4145248 (1979-03-01), Van Eanam et al.
patent: 4158070 (1979-06-01), Lewicki, Jr. et al.
patent: 4256809 (1981-03-01), Larsson et al.
patent: 4279959 (1981-07-01), Falgiatore et al.
patent: 4297400 (1981-10-01), Kern et al.
patent: 4312914 (1982-01-01), Guth
patent: 4449978 (1984-05-01), Iacoviello
patent: 4505951 (1985-03-01), Kennedy
Airflex.TM. 120 Nonwoven Binder Brochure.
Airflex 105 Nonwoven Binder Brochure.
Airflex 120 Emulsion Brochure.
Airflex 105 Emulsion Brochure.
Davidowich George
Rosamilia Peter L.
Air Products and Chemicals Inc.
Innis E. Eugene
Leach Michael
Page Thurman K.
Simmons James C.
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