Low-temperature curing epoxy resin composition

Details Low-temperature curing epoxy resin composition Low-temperature curing epoxy resin composition

1990-11-19

1993-06-01

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525524, 525526, 525530, C08F28300, 208G 828

Patent

active

052160939

ABSTRACT:
The present invention discloses a low-temperature curing epoxy resin composition including: an epoxy resin main agent to which unsaturated acid ester of polyhydric alcohol is added and which contains epoxy resin having urethane bonds in the molecules thereof; and a curing agent containing an alicyclic amine compound. This epoxy resin composition may be rapidly cured even at a low temperature and presents a good work efficiency. This epoxy resin composition may be prepared as a cured body excellent in resistance to hot water, mechanical strength, impact resistance and the like.

REFERENCES:
patent: 3239580 (1966-03-01), Pendleton et al.
patent: 3624178 (1971-11-01), Lohse et al.
patent: 4632970 (1986-12-01), Hiza et al.
patent: 4861832 (1989-08-01), Walsh
European Search Report.

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