Low temperature curing epoxy resin

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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528112, C08G 5950

Patent

active

042972540

ABSTRACT:
A methane diamine cured solventless liquid epoxy composition is disclosed. The composition contains an oil-modified epoxy rsin having an EEW of about 300 to 600 which is formed by reacting about 5 to about 50% of a triglyceride of a C.sub.10 to C.sub.20 fatty acid with about 50 to about 95% of an epoxy resin having at least one aliphatic hydroxyl group per molecule. The composition also contains about 0.01 to about 0.3 phr of a catalyst, up to about 80% of a glycidyl either of a phenol, about 1 equivalent, .+-.20%, of methane diamine, and about 0.2 to 3% of an accelerator.

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patent: 3974113 (1976-08-01), Sassano et al.
patent: 4069202 (1978-01-01), Carey
patent: 4180607 (1979-12-01), Sasaki et al.

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