Low temperature curing acrylate and maleimide based...

Details Low temperature curing acrylate and maleimide based... Low temperature curing acrylate and maleimide based...

2008-04-14

2011-11-22

Wu, David W (Department: 1762)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

C526S313000, C526S286000, C526S321000

Reexamination Certificate

active

08063161

ABSTRACT:
The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

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