Low temperature cure polyimide compositions resistant to arc...

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Reexamination Certificate

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C524S538000, C525S432000, C528S353000

Reexamination Certificate

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11322586

ABSTRACT:
The polyimides of the present invention are derived from aliphatic diamines and show advantageous arc tracking performance (i.e., low arc tracking). These polyimides can be cured at low temperatures making them suitable as coverlay compositions in electronic circuitry. In addition, these polyimides are soluble and excellent in heat resistance and adhesion properties, showing a low dielectric constant even at 10 GHz or more.

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patent: 1996/250860 (1996-09-01), None

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