Low temperature cure having single component conductive adhesive

Details Low temperature cure having single component conductive adhesive Low temperature cure having single component conductive adhesive

1987-01-28

1988-05-31

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

523457, 523459, 523442, 528 90, A01B 104

Patent

active

047479680

ABSTRACT:
An electrically conductive adherent film-forming adhesive which is rapidly curable thermally from a flowable liquid to an adherent and coherent solid at temperatures below about 120.degree. C. and with a specific resistivity of less than about 0.001 ohm-cm. when cured, and comprising a uniform mixture with a formulation containing a liquid epoxy base resin, a hardening component for the epoxy resin consisting essentially of B.multidot.CF.sub.3 SO.sub.3 H, and silver metallic powder in an amount ranging from about 75% to 85%, with the powder having a substantial uniform particle size of less than about 20 microns (0.8 mil) in diameter.

REFERENCES:
patent: 4101459 (1978-07-01), Andrews
patent: 4210704 (1980-07-01), Chandross et al.
patent: 4407674 (1983-10-01), Ehrreich
patent: 4410457 (1983-10-01), Fujimura et al.

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