Low temperature cure epoxy-amine adhesive compositions

Details Low temperature cure epoxy-amine adhesive compositions Low temperature cure epoxy-amine adhesive compositions

1976-12-10

1978-09-12

Pertilla, Theodore E.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260830TW, 427195, 428413, 428415, 428416, 428417, 428418, C08L 6300

Patent

active

041136845

ABSTRACT:
A composition, which is suitable for use as an adhesive, is made by mixing: (A) 1 part of an adduct reaction product consisting of a solid epoxy resin and a stoichiometric excess of an aliphatic amine; with (B) about 1 part to about 6 parts of a reactive solid epoxy resin powder having an average particle size of from about 10 microns to about 420 microns, the mixture being capable of melting at temperatures of over about 60.degree. C; wherein the epoxy of (B) remains unreacted until melting.

REFERENCES:
patent: 2786794 (1957-03-01), Gams
patent: 2828236 (1958-03-01), West
patent: 3625918 (1971-12-01), Heer et al.
patent: 3723223 (1973-03-01), Le Compte
patent: 3842035 (1974-10-01), Klaren
patent: 3860541 (1975-01-01), Lehmann et al.

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