Low temperature curable organic resin compositions

Details Low temperature curable organic resin compositions Low temperature curable organic resin compositions

1980-02-19

1980-12-16

Foelak, Morton

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

264 53, 264331, 264DIG83, 521 99, 521101, 521125, 521154, 521178, 521181, 521182, 526273, 526290, 528 92, 528139, 528275, 528361, 528409, C08F 444

Patent

active

042397251

ABSTRACT:
Low temperature curable organic resin compositions, for example, epoxy resins are provided, which can be either exothermically cured or cured in several minutes or less at relatively low temperatures. Certain diaryliodonium salts have been found to spontaneously release strong protonic acids when used in combination with a copper salt and a reducing agent.

REFERENCES:
patent: 3691133 (1972-09-01), Sura

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