Low temperature curable conductive adhesive and capacitors...

Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S523000, C361S528000, C361S529000, C361S516000, C361S519000, C029S025010, C029S025030

Reexamination Certificate

active

07554793

ABSTRACT:
An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has:60-95 wt % conductor;5-40 wt % resin; wherein the resin has:55-98.9 wt % monomer defined by the formula:wherein: R is an aliphatic group of 1 to 10 carbons;R1is an aliphatic group of 1 to 10 carbons;R2is an alkyl, alkyl ether, aryl ether, silane or silicone; andwherein R and R1, R and R2or R1and R2may be taken together to form a cyclic alkyl or aryl group;0.1-15 wt % catalyst;1-30 wt % accelerant defined by the formula:wherein R3is an alkyl or substituted alkyl of 1-10 carbons; andR4is an alkyl or substituted alkyl of 1-10 carbons with the proviso that at least one of R3and R4is substituted with a OR5wherein R5is selected from hydrogen, alkyl and aryl; and0-15 wt % filler.

REFERENCES:
patent: 5910370 (1999-06-01), Katsura et al.
patent: 6086642 (2000-07-01), Fukaumi et al.
patent: 6165386 (2000-12-01), Endo et al.
patent: 6473293 (2002-10-01), Shimada et al.
patent: 6666994 (2003-12-01), Takezawa et al.
patent: 6780898 (2004-08-01), Kumakura
patent: 6881765 (2005-04-01), Sasaki
patent: 7023689 (2006-04-01), Matsummoto et al.
patent: 2004/0125543 (2004-07-01), Hirano et al.
patent: 2004/0225045 (2004-11-01), Forray
patent: 2006/0009547 (2006-01-01), Maeshima et al.
patent: 2006/0111496 (2006-05-01), Gillissen et al.
patent: 2003306659 (2002-04-01), None
XP002512721, Feb. 21, 2001, Database WPI Thomson Scientific, London.
XP002512722, Jul. 5, 2006, Database WPI Thomson Scientific London.
International Search Report, Nov. 16, 2007, Kemet Electronics Corporation, Autorized Officer Alicja Van der Heijden.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low temperature curable conductive adhesive and capacitors... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature curable conductive adhesive and capacitors..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature curable conductive adhesive and capacitors... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4073558

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.