Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-07-31
1993-10-05
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165 804, 16510433, 174 152, 174 154, 361382, 361385, 361386, 361388, 361687, 361690, 361698, 361707, H05K 720
Patent
active
052510956
ABSTRACT:
A hermetic electronic assembly incorporating cryogenically-cooled and air-cooled elements in an integrated assembly. A hermetic cryogenically-cooled enclosure is disposed in close physical proximity to one or more air-cooled circuit cards to minimize physical separation, thereby optimizing signal bandwidth and noise immunity. The air-cooled circuit cards, which generate substantial heat but do not require low operating temperatures, are thermally decoupled from the cryogenically-cooled elements to optimize cryo-cooler efficiency by reserving cooling capacity for the temperature-sensitive processor elements mounted within an evacuated hermetic enclosure. Thus, thermal isolation and physical/electrical proximity are preserved in the same package.
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"Conductive Cooled Processor & Main Memory at Cryogenic Temperatures" by H. A. Carlson et al.; IBM Bull.; vol. 32, No. 10A (Mar. 1990).
"Nitrogen-Cooled Central Electronics Complex" by H. A. Carlson et al.; IBM Bulletin; vol. 32, No. 10A, Mar. 1990.
Miller William C.
Smith Russell N.
Stutzman Randall J.
International Business Machines - Corporation
Thompson Gregory D.
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