Wave transmission lines and networks – Long line elements and components – Strip type
Patent
1988-12-27
1990-02-06
Gensler, Paul
Wave transmission lines and networks
Long line elements and components
Strip type
333247, 361414, H01P 500
Patent
active
048991180
ABSTRACT:
A low temperature cofired monolithic ceramic package (10) for use with microwave and millimeter wave gallium arsenide integrated circuits, or the like. In situ buried passive components (28), including capacitors, resistors, couplers and inductors are incorporated within a cofired substrate structure (12). Fields of interconnected staggered or stacked vias (56, 58) are provided in the substrate below the integrated circuit for efficient heat transfer and electrical connection to a ground plane that eliminates complicated heat sink strucutres. At least one cavity (24) is provided in the top surface to confine integrated circuit chips. A plurality of connectable electrical conductors (34,36,38,40,42) including RF input and output leads and DC bias leads for the chip extend from the edge of the substrate (12) to the edge of the cavity (24). A sidewall 14 is extends around the periphery of the cavity (42) and comprises a low temperature cofired structure which is cofired with the substrate (12). The sidewall 14 has a metalized top surface and interconnected metalization and vias extending from the top surface to the top surface layer of the substrate (12). A cover (16) is provided which is attachable to the metalized top surface (44) of the sidewall (14). The electrical and thermal interconnections provided in the sidewall (14) and substrate (12) are provided by means of the plurality of interconnected staggered or stacked via interconnects. Electrical and thermal integrity is achieved which permits dissipation of heat by way of the ground plane and top cover, and electrial shielding is achieved by interconnecting the conductive components.
REFERENCES:
patent: 4574255 (1986-03-01), Fujii et al.
patent: 4672152 (1987-06-01), Shinohara et al.
patent: 4724283 (1988-02-01), Shimada et al.
"Next-Generation High-Speed Packaging", Gary Holz, Jan. 1988, pp. 32-40.
"Development of a Low Temperature Cofired Multilayer Ceramic Technology", William A. Vitriol et al, 1983 ISHM Proceedings, pp. 593-598.
"Electronic Packaging Using Low Temperature Co-Fireable Ceramics", A. L. Eustice et al, Jun. 1987, Hybrid Circuit Technology, pp. 9-14.
"A New Low Temperature Fireable Ag Multilayer Ceramic Substrate Having Post-Fired Cu Conductor" (LFC-2), S. Nishigaki et al, 1986 ISHM Proceedings, pp. 429-444.
"Low Firing Temperature Multilayer Glass-Ceramic Substrate", Y. Shimada et al, Proceedings 33rd Electronic Components Conference (1983), pp. 314-319.
"Co-Fired Ceramic Multilayers: When Reliability Counts", R. Keeler, Electronic Packaging and Production, May 1987, pp. 40-42.
"Processing and Reliability of Resistors Incorporated Within Low Temperature Cofired Ceramic Structures", R. Pond et al, 1983, ISHM Proceedings, pp. 461-472.
"Low Temperature Co-Fireable Ceramics with Co-Fired Resistors", H. T. Sawhill et al, 1986 ISHM Proceedings, pp. 268-271.
Denson-Low Wanda
Gensler Paul
Gudmestad Terje
Hughes Aircraft Company
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