Low-temperature co-fired ceramics material and multilayer...

Details Low-temperature co-fired ceramics material and multilayer... Low-temperature co-fired ceramics material and multilayer...

2007-12-11

2007-12-11

Group, Karl (Department: 1755)

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

C428S426000, C428S428000

Reexamination Certificate

active

11166367

ABSTRACT:
Objects of the present invention are to provide a low-temperature co-fired ceramic material having a coefficient of linear thermal expansion controlled and has a high dielectric constant, and to reduce the warpage of a fired product even if it has an unsymmetrical lamination structure in a multilayer wiring board in which glass-ceramic mixed layers of different compositions are laminated.A low-temperature co-fired ceramic material in accordance with the present invention includes: SiO2—B2O3—Al2O3— alkaline earth metal oxide based glass, alumina, titania, and cordierite; glass, titania, and cordierite; or glass, titania, and mullite. When a multilayer wiring board is made of the low-temperature co-fired ceramic material, the content of cordierite or mullite of the substrate material is adjusted to control a difference in a coefficient of linear thermal expansion between the layers of the substrate material to not more than 0.25×10−6/° C.

REFERENCES:
patent: 4777092 (1988-10-01), Kawakami et al.
patent: 4939106 (1990-07-01), Miyakoshi et al.
patent: 0 552 377 (1993-07-01), None
patent: 05-211006 (1993-08-01), None
patent: 7-58454 (1995-03-01), None
patent: 2000-264677 (2000-09-01), None
patent: 2004-083373 (2004-03-01), None
Patent Abstracts of Japan, JP 01-132194, May 24, 1989.

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