Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-08-25
2009-06-23
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S122000, C438S048000, C438S064000, C257S701000, C257S432000, C257SE25032
Reexamination Certificate
active
07550319
ABSTRACT:
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.
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Cheng Jaw-Shin
Kao Shih-Ming
Lin Yu-Cheng
Wang Carl B.
E. I. du Pont de Nemours and Company
Parekh Nitin
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