Low temperature co-fired ceramic (LTCC) high density interconnec

Details Low temperature co-fired ceramic (LTCC) high density interconnec Low temperature co-fired ceramic (LTCC) high density interconnec

1992-12-02

1995-10-24

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257700, 361735, H01L 2302

Patent

active

054611962

ABSTRACT:
A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.

REFERENCES:
patent: 5150088 (1992-09-01), Virga
patent: 5227583 (1993-07-01), Jones
patent: 5254871 (1993-10-01), Benavides et al.
patent: 5255430 (1993-10-01), Tallausen
patent: 5331204 (1994-07-01), Kuroda et al.
"Development of a LowTemperature Co-fired Multilayer Ceramic Technology", W. A. Vitriol et al., 1983 ISHM Proceedings, pp. 493-598.
"Processing and Reliability of Resistors Incorporated Within Low Temperature Co-fired Ceramic Structures", R. G.Pond et al., 1986 ISHM Proceedings, pp. 461-472.
"Low Temperature Co-Fireable Ceramics with Co-Fired Resistors", H. T. Sawhill, et al., 1986 ISHM Proceedsings, pp. 268-271.

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