Low temperature CMOS/SOS process using dry pressure oxidation

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29576B, 29578, 29590, 148 15, 204192E, B01J 1700

Patent

active

041797922

ABSTRACT:
An enhancement type, self-aligned silicon gate complementary metal oxide semiconductor (CMOS)/silicon on sapphire (SOS) structure is made by generating all gate oxides and oxide isolated regions with dry oxygen at pressures above 1 atmosphere and at temperatures of 800.degree. C. to 825.degree. C. using ion implantation for all doping operations and plasma definition of all masking dielectrics.

REFERENCES:
patent: 3590471 (1971-07-01), Lepselter
patent: 4117301 (1978-09-01), Goel
Electrochem. Soc.: Solid-State Science & Technology, "Dry Pressure Local dation of Silicon for IC Isolation", by Marshall et al., Oct. 1975, pp. 1411 & 1412.
Electrochem. Soc.: Solid-State Science & Technology, "Low Temp. Thermal Oxidation of Silicon by Dry Oxygen Pressure above 1 Atm", by Zeto et al., Oct. 1975, pp. 1409 & 1410.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low temperature CMOS/SOS process using dry pressure oxidation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature CMOS/SOS process using dry pressure oxidation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature CMOS/SOS process using dry pressure oxidation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2065176

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.