Low temperature bonding material comprising metal particles...

Details Low temperature bonding material comprising metal particles... Low temperature bonding material comprising metal particles...

2011-06-07

2011-06-07

Le, H. (Holly) T (Department: 1788)

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

C075S247000, C075S255000, C428S403000, C428S543000, C428S548000, C428S570000

Reexamination Certificate

active

07955411

ABSTRACT:
A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

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Machine translation of JP 2004-107728, Apr. 2004.
Allen et al., Gateway Reactions to Diverse, Polyfunctional Monolayer-Protected Gold Clusters, J. Am. Chem. Soc. 1998, 120, 4845-4849.

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