Specialized metallurgical processes – compositions for use therei – Processes – Free metal or alloy reductant contains magnesium
Patent
1976-06-14
1977-07-26
Ozaki, G.
Specialized metallurgical processes, compositions for use therei
Processes
Free metal or alloy reductant contains magnesium
75 5A, 75117, 204106, 204108, 423 42, C22B 1512
Patent
active
040380700
ABSTRACT:
Copper values are recovered from an acidic solution of solubilized cupric ions by the reduction of cupric copper to cuprous copper with hydrogen gas in the presence of a solid hydrogenation catalyst and in the presence of a cuprous ion stabilizing ligand. Catalyst poisoning by precipitation of copper metal on the surface of the catalyst during the reduction is avoided by controlling the ratio of Cu.sup.+/ligand/Cu.sup.+.sup.+ and by terminating the hydrogenation before copper metal precipitates on the catalyst. The solution containing the cuprous ions is separated from the solid catalyst and the cuprous ions are then disproportionated to produce copper metal and cupric ions.
The removal of the last amounts of cupric ions from solutions, after several stages of reduction and disproportionation is achieved by allowing the cupric ions to precipitate on the catalyst as copper metal. The catalyst is then separated from the copper barren raffinate and regenerated by exposing it to a fresh pregnant cupric ion solution in the presence of a cuprous ion stabilizing ligand.
REFERENCES:
patent: 2440612 (1948-04-01), Lichtenwalter
patent: 3844763 (1974-10-01), Burkin
patent: 3865580 (1975-02-01), Hummel
patent: 3865744 (1975-02-01), Parker et al.
patent: 3883351 (1974-09-01), Neskorg et al.
patent: 3937657 (1976-02-01), Parker et al.
patent: 3961028 (1976-06-01), Parker et al.
patent: 3966890 (1976-06-01), Parker et al.
patent: 3983017 (1976-09-01), Szabo
Pemsler J. Paul
Rappas Alkis S.
Kennecott Copper Corporation
Lorusso Anthony M.
Ozaki G.
Sniado John L.
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