Low temperature and low cost assembly process for nonlinear resi

Details Low temperature and low cost assembly process for nonlinear resi Low temperature and low cost assembly process for nonlinear resi

1978-06-15

1980-02-19

Larson, Lowell A.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 29590, 29628, 357 10, H01B 108

Patent

active

041890833

ABSTRACT:
A low cost two step process for attaching conductive leads and heat dissipating elements and for encapsulating a ceramic non-linear resistor pellet is described. Low temperature soldering techniques are utilized to assemble the device. Low temperature soldering is made feasible by the treatment of the attaching surfaces of the pellet with a dilute solution of acid for reducing the oxide surface to a pure metal in preparation for soldering.

REFERENCES:
patent: 2169098 (1939-08-01), Howe
patent: 3217401 (1965-11-01), White
patent: 3503029 (1970-03-01), Matsuoka
patent: 3810068 (1974-05-01), DeLuca

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