Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2008-06-05
2010-12-14
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S050000, C257SE21536
Reexamination Certificate
active
07851239
ABSTRACT:
Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.
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Chung Wonsuk
Tu Thanh Nghia
Webster James Randolph
Yan Xiaoming
Knobbe Martens Olson & Bear LLP
Pert Evan
Qualcomm MEMS Technologies, Inc.
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