Low temperature adhesion bonding method for composite substrates

Details Low temperature adhesion bonding method for composite substrates Low temperature adhesion bonding method for composite substrates

1997-07-30

2000-07-25

Dutton, Brian

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

438118, 438457, 438459, H01L 2100, H01L 2130, H01L 2144, H01L 2148

Patent

active

060935774

ABSTRACT:
A method of bonding a first substrate (10) to a second substrate (30) is described, comprising the steps of: coating an adhesive (28) onto a first major surface of said first substrate (10); aligning said first and second substrates (10, 30) so that said coated first major surface of said first substrate (10) is facing said second substrate (30) and is separated therefrom by a gap (47); deflecting at least one of said first and second substrates (10, 30) by exerting a pressure between said first and second substrates (10, 30) substantially at the center thereof so that the adhesive coating (28) substantially at the center of said first substrate (10) comes into contact with said second substrate (30); and allowing the remaining parts of said adhesive coated first major surface of said first substrate (10) to come into contact with said second substrate (30). Use of the method to produce composites, in particular transmissive liquid crystal display panels is also described.

REFERENCES:
patent: 4338151 (1982-07-01), Hutter, III
patent: 5478782 (1995-12-01), Satoh et al.
patent: 5674758 (1997-10-01), McCarthy
patent: 5702963 (1997-12-01), Vu et al.
patent: 5812232 (1998-09-01), Shiroto et al.

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