Low stress, tolerance free method for mounting power devices

Details Low stress, tolerance free method for mounting power devices Low stress, tolerance free method for mounting power devices

1985-05-29

1986-12-30

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

174 16HS, 357 80, 361386, H05K 339

Patent

active

046318194

ABSTRACT:
A low stress, tolerance free method for mounting a power device to a heat sink is disclosed. The power device is soldered into a break-away area created on a printed circuit (PC) board which is separated from the main PC board prior to final assembly. The main PC board may be mounted in a housing using any suitable means and the power device may be affixed to a heat sink regardless of tolerance build up so long as sufficient "travel" is created in the jumper wires which couple the break-away PC board to the main PC board.

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patent: 4387413 (1983-06-01), Griffis
patent: 4389697 (1983-06-01), Bell et al.

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