Low stress multichip module

Details Low stress multichip module Low stress multichip module

1990-09-21

1991-12-24

James, Andrew J.

357 81, H01L 2340

Patent

active

050757652

ABSTRACT:
A multichip integrated circuit module includes a ceramic substrate, a plurality of integrated circuit chips mounted on the substrate, and a metal lid which covers the chips and rests on the substrate without attaching to it. Also, the module includes two thin cylindrical members. One cylindrical member surrounds the substrate and makes an airtight solder joint to the substrate's perimeter, while the other cylindrical member surrounds the lid and makes an airtight solder joint to the lid's perimeter. Both cylindrical members run parallel to each other and make an airtight welded joint with each other. When the lid and substrate thermally expand at unequal rates, one thin cylindrical member is deflected by the other member. When a defective chip is replaced, the joint between the two cylindrical members is ground away; and subsequently, the remaining parallel portions of the cylindrical members are rewelded together.

REFERENCES:
patent: 3310716 (1967-03-01), Emeis
patent: 3753054 (1973-08-01), Johnson
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4351051 (1982-09-01), Van Alem et al.
patent: 4355323 (1982-10-01), Kock
patent: 4399452 (1983-08-01), Nakashima et al.
patent: 4399453 (1983-08-01), Berg et al.
patent: 4456334 (1984-06-01), Hery et al.
Koopman, "Ground Plane Cover", IBM TDB, vol. 19, No. 9, Feb./1977, p. 3370.

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