Low stress mounting of integrated optic chips

Details Low stress mounting of integrated optic chips Low stress mounting of integrated optic chips

1986-11-04

1988-06-14

Sikes, William L.

G02B 612, G02B 610, H01L 2302, H01J 500

Patent

active

047508000

ABSTRACT:
An integrated optic IO device chip with anisotropic thermal expansion properties is packaged in a material enclosure by first bonding the chip to a substrate having anisotropic thermal expansion properties substantially equivalent to those of the IO device and substrate thickness substantially greater than that of the IO device, and bonding the substrate to the enclosure.

REFERENCES:
patent: 3874782 (1975-04-01), Schmidt
patent: 4400052 (1983-08-01), Alferness
patent: 4649624 (1987-03-01), Reedy

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