Low stress liquid cooling assembly

Details Low stress liquid cooling assembly Low stress liquid cooling assembly

1988-04-18

1989-02-28

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

H02B 100, H05K 720

Patent

active

048091340

ABSTRACT:
A liquid cooled electronic circuit includes a printed circuit board having two oppositely facing surfaces, electronic components mounted on one of the two surfaces, and conduits which carry a liquid and touch the electronic components to cool them; wherein a frame is also provided for holding the conduits snugly against the components without overstressing the printed circuit board. This frame is characterized as having: (a) a first set of contacts which engage the conduits; (b) a second set of contacts which engage the surface of the printed circuit board opposite the one surface; (c) the contacts of the second set being spaced apart and located at predetermined distances from the board's perimeter; and (d) fasteners for urging the conduits against the electronic components by moving the first and second sets of contacts toward each other with the conduits, the electronic components, and the printed circuit board lying therebetween.

REFERENCES:
patent: 4226281 (1980-10-01), Chu
patent: 4381032 (1983-04-01), Cutchaw
patent: 4649990 (1987-03-01), Kurihara et al.

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