Low stress die attachment

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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Details

C206S521000

Reexamination Certificate

active

06861587

ABSTRACT:
A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

REFERENCES:
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patent: 5285559 (1994-02-01), Thompson et al.
patent: 5375469 (1994-12-01), Levy et al.
patent: 5535626 (1996-07-01), Bullis et al.
patent: 5540593 (1996-07-01), Takahashi
patent: 5810607 (1998-09-01), Shih et al.
patent: 5932891 (1999-08-01), Higashi et al.
patent: 5993248 (1999-11-01), Bethurum
patent: 2304903 (1997-03-01), None
patent: 11072534 (1999-09-01), None

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