Low-stress coupling of electrooptical device to optical fiber

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

385 93, 385 84, G02B 636

Patent

active

053116100

ABSTRACT:
An electrooptical device, such as a semiconductor laser, and an optical fiber are packaged together in light coupling alignment using an electrolytic technique that avoids heat-induced stresses that commonly result from joining methods that employ welding, soldering, or catalytic adhesive compositions. The particular technique of this invention also avoids the need to encapsulate the electrooptical device within an index matching gel to protect it from the electrolytic plating solution thereby enabling optical devices such as lenses, isolators, filters, etc, to be incorporated in the package. The electrooptical device is mounted onto a common metallic base and the optical device is mounted within the bore of a tubular metallic support member. This support member is affixed to the base by means of nodes of a flexible conductive gel and is positioned relative to the electrooptical device for maximum light coupling between the device and the optical fiber within the support member. A non-metallic bottomless container is disposed on the base over the support member and the nodes of conductive gel (but not over the electrooptical device) to form a liquid-tight interior region for containing a low-stress electrolytic plating solution. The base, the nodes of conductive gel and the portion of the fiber support member within the container form the cathode in a plating circuit and are plated together to fix the alignment of the device and the fiber at its optimum coupling position.

REFERENCES:
patent: 5048919 (1991-09-01), Ladany
patent: 5175783 (1992-12-01), Tatoh
patent: 5181264 (1993-01-01), Chiaretti et al.
patent: 5216737 (1993-06-01), Driessen et al.
"Optical Components--The New Challenge in Packaging", M. Matthews, B. MacDonald, K. Preston, IEEE Trans. Comp. Hybrids Manu. Tech., vol. 13, No. 4, Dec. 1990, pp. 798-806.
"A Stable Laster Module with UV-Curable Resin for Single-Mode Subscriber Use", M. Suzuki, T. Nakanishi, N. Tsuzuki, N. Murata, Proc. 40th ECTC., vol. 1, 1990, pp. 200-205.
"Optical-Mechanical Considerations for Laser-Fiber Coupling and Packaging", SPIE Proc., Int. Lens Design Conf., vol. 554, 1985, pp. 308-312.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low-stress coupling of electrooptical device to optical fiber does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low-stress coupling of electrooptical device to optical fiber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-stress coupling of electrooptical device to optical fiber will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2417674

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.