Low stress cavity package

Details Low stress cavity package Low stress cavity package

2011-01-11

2011-01-11

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE21510, C257SE23037, C438S123000

Reexamination Certificate

active

07868433

ABSTRACT:
The present invention relates to methods and arrangements for forming a low stress cavity package. Particular methods may be performed with existing packaging equipment. In one such method, a leadframe laminated with adhesive film is provided. Integrated circuit dice are connected to the leadframe by reflowing solder between bond pads on the active surface of each die and the leadframe. A viscous thermosetting material is dispensed around the periphery of the active surface of each die. The thermosetting material fills gaps between the solder joint connections and the adhesive film. As a result, the thermosetting material, solder joint connections, each integrated circuit die and the adhesive film define and seal a protective cavity between the active surface of the die and the adhesive film. Portions of each die, leads, solder joint connections and adhesive film are encapsulated with a molding material that is prevented from entering the sealed cavity.

REFERENCES:
patent: 6476885 (2002-11-01), Murray et al.
patent: 6933605 (2005-08-01), Tao et al.
patent: 7015587 (2006-03-01), Poddar
patent: 7205095 (2007-04-01), Prabhu et al.
patent: 2002/0031865 (2002-03-01), Chen et al.
patent: 2002/0056905 (2002-05-01), Miyaki et al.
patent: 2008/0315382 (2008-12-01), Wallace
U.S. Appl. No. 11/048,309, filed Jan. 31, 2005.
U.S. Appl. No. 10/953,002, filed Sep. 28, 2004.
U.S. Appl. No. 11/836,662, filed Aug. 9, 2007.
U.S. Appl. No. 10/969,729, filed Oct. 19, 2004.

Affiliated with

Also associated with

Rating

Low stress cavity package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low stress cavity package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low stress cavity package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2706022