Low stress ball grid array package

Details Low stress ball grid array package Low stress ball grid array package

1995-03-13

1996-12-17

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174254, 361749, 361767, 361769, 361771, 361774, 361787, 361790, 361803, 29843, H05K 111, H05K 114, H01R 909

Patent

active

055860109

ABSTRACT:
The ball grid array package (10) uses a flexible base (30) having a substantially flat center plate (34) disposed at a first level coupled to a substantially flat base plate (32) disposed at a second level. The center plate (34) is coupled to the base plate (32) by a plurality of flexible narrow straps (36-38) arranged substantially surrounding the center plate (34). The flexible base (30) accommodates the thermal expansion in the pedestal (18) caused by the powered up integrated circuit (16) so that the rest of the package does not expand and induce stress in the solder joint between the ball grid array (12) and the printed circuit board (14).

REFERENCES:
patent: 4631820 (1986-12-01), Harada et al.
patent: 4758927 (1988-07-01), Berg
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 5018005 (1991-05-01), Lin et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5430614 (1995-07-01), DiFrancesco
IBM Technical Disclosure Bulletin "Improved Method for C-4 Chip Join" vol. 31 No. 6, Nov. 1988.
IBM Technical Disclosure Bulletin "TAB Tape Structure for Area Array TAB" vol. 32, No.2 7-89.

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