Low softening temperature thermal conductive adhesive...

Details Low softening temperature thermal conductive adhesive... Low softening temperature thermal conductive adhesive...

2005-05-03

2005-05-03

Nutter, Nathan M. (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S232000, C525S238000, C525S240000, C524S401000, C524S404000, C524S424000, C524S441000, C524S444000, C524S445000, C524S450000, C524S503000, C524S515000, C524S521000, C524S524000

Reexamination Certificate

active

06887942

ABSTRACT:
A low softening temperature thermal conductive adhesive composition is made from a blend of liquid NBR in molecular weight of 300˜100,000 and ethylene vinyl acetate (EVA) to have a softening point of 38˜65° C. With proper addition of sub-micron or nano powder thermal conductive agents like aluminum oxide, zinc oxide, aluminum nitride, boron nitride, graphite, metal powder or nano clay, the adhesive can be made into a membrane with thickness of 0.01˜5 mm and thermal conductivity of 0.5˜5 W/m-K, and thermal conductive plate with thermal resistance of 0.005˜0.2° C.in2/W. The thermal conductive plate has softening point of 38˜65° C., preferably 45° C. to avoid liquidation during storage and transportation. Further application includes use as the sealant or thermal conductive interface in electronic components and heat dissipaters to reduce heat resistance and improve thermal conductive efficiency.

REFERENCES:
patent: 5898018 (1999-04-01), Hirano et al.
patent: 6773772 (2004-08-01), Shinozaki et al.

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