Low sodium, low metals silica polishing slurries

Compositions – Solids with solution or dispersion aids

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Details

2523132, 51283R, 51308, B24B 100, C09G 102

Patent

active

052308332

ABSTRACT:
A colloidal silica slurry comprising: a low metals ammonium-stabilized silica sol having the following characteristics: SiO.sub.2 present in the range between about 15 to about 50 weight percent; a pH in the range between about 8.5 to about 11.3; a particle diameter in the range between about 4.0 to about 130 nm; aluminum, as Al, present in an amount less than about 100 ppm, based on SiO.sub.2 ; iron, as Fe, present in an amount less than about 50 ppm, based on SiO.sub.2 ; potassium, as K, present in an amount less than about 25 ppm, based on SiO.sub.2 ; and sodium, as Na, present in an amount less than about 500 ppm, based on SiO.sub.2 ; and a bactericide, a polishing rate accelerator which differs from the bactericide, and/or a sodium chlorite or sodium hypochlorite biocide. Optionally, a fungicide may also be added to the colloidal silica slurry to inhibit fungi growth.

REFERENCES:
patent: 2801216 (1957-07-01), Yoder et al.
patent: 2823186 (1958-02-01), Nickerson
patent: 3024089 (1962-03-01), Spencer et al.
patent: 3046234 (1962-07-01), Roman et al.
patent: 3148110 (1964-09-01), McGahen
patent: 3336236 (1967-08-01), Michalski
patent: 3377275 (1968-04-01), Michalski et al.
patent: 3816330 (1974-06-01), Havens
patent: 3860431 (1975-01-01), Payne et al.
patent: 4169337 (1979-10-01), Payne
patent: 4462188 (1984-07-01), Payne
patent: 4588421 (1986-05-01), Payne
patent: 4624800 (1986-11-01), Sasaki et al.
patent: 4664679 (1987-05-01), Kohyama et al.
patent: 4892612 (1990-01-01), Huff
Iler, "The Chemistry of Silica", Wiley Interscience, 1979, p. 359.
Stober et al., "Controlled Growth of Monodisperse Silica Spheres in Micron Size Range", Journal of Colloid & Interface Science, 26, 61-69 (1968).
Wagner et al., "Aerosil, Herstellung, Eigenschaften und Verhalten in orgnaischen Flussigkeiten", Angew. Chem., 72, 1960, Nr 19/20.
Aulich et al., "New Methods to Prepare High-purity Silica", Journal of Materials Science, 19(1984) 1710-1717.

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