Low signal loss bonding ply for multilayer circuit boards

Details Low signal loss bonding ply for multilayer circuit boards Low signal loss bonding ply for multilayer circuit boards

2005-03-01

2005-03-01

Lam, Cathy F. (Department: 1775)

Coating processes

Coating remains adhesive or is intended to be made adhesive

C427S208000, C428S209000, C428S297400, C428S344000, C174S258000, C174S259000

Reexamination Certificate

active

06861092

ABSTRACT:
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

REFERENCES:
patent: 2932599 (1960-04-01), Dahlgren
patent: 2955974 (1960-10-01), Allen et al.
patent: 3606677 (1971-09-01), Ryan
patent: 3649475 (1972-03-01), Degnan et al.
patent: 4403653 (1983-09-01), Davidson
patent: 4680220 (1987-07-01), Johnson
patent: 4784901 (1988-11-01), Hatakeyama et al.
patent: 4849284 (1989-07-01), Arthur et al.
patent: 4886699 (1989-12-01), Carroll et al.
patent: 4902556 (1990-02-01), Benedikt et al.
patent: 5001010 (1991-03-01), Chao et al.
patent: 5043367 (1991-08-01), Hallgren et al.
patent: 5108842 (1992-04-01), Hallgren et al.
patent: 5141791 (1992-08-01), Chao et al.
patent: 5162450 (1992-11-01), Chao et al.
patent: 5213886 (1993-05-01), Chao et al.
patent: 5214571 (1993-05-01), Dahlgren et al.
patent: 5218030 (1993-06-01), Katayose et al.
patent: 5250347 (1993-10-01), Mehta et al.
patent: 5352745 (1994-10-01), Katayose et al.
patent: 5538756 (1996-07-01), Koreleski et al.
patent: 5571609 (1996-11-01), St. Lawrence et al.
patent: 5635293 (1997-06-01), Korleski et al.
patent: 5652055 (1997-07-01), King et al.
patent: 6929518 (1999-07-01), Schlaiss
patent: 6066386 (2000-05-01), Boyko et al.
patent: 6108903 (2000-08-01), Nakatani et al.
patent: 6254972 (2001-07-01), Farquhar et al.
patent: 6291374 (2001-09-01), Landi
patent: 6388204 (2002-05-01), Lauffer et al.
patent: 6500529 (2002-12-01), McCarthy et al.
patent: 0 334 499 (1989-09-01), None
patent: 1 117 281 (2001-07-01), None
patent: 2 109 166 (1993-05-01), None
patent: 60 235844 (1985-11-01), None
patent: 63-081 139 (1988-04-01), None
patent: 02-245 330 (1990-01-01), None
patent: 03-110158 (1991-05-01), None
patent: 6-322157 (1994-11-01), None
patent: 11-112 147 (1999-04-01), None
patent: WO 03026371 (2003-03-01), None
Frankosky, J.,Processing PTFE/Clad PCBS, Printed Circuit Fabrication, vol. 15, No. 11, Nov. 1992, pp. 22, 25.
U.S. Appl. No. 10/448,081, Filed May 29, 2003,Low Signal Loss Bonding Ply for Multilayer Circuit Boardsto McCarthy et al. (Our Ref No.: 1350.069B).

Affiliated with

Also associated with

Rating

Low signal loss bonding ply for multilayer circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low signal loss bonding ply for multilayer circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low signal loss bonding ply for multilayer circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3402366