Low shrinkage thermosetting resin compositions and methods...

Details Low shrinkage thermosetting resin compositions and methods... Low shrinkage thermosetting resin compositions and methods...

2005-11-08

2005-11-08

Lambkin, Deborah C. (Department: 1626)

Organic compounds -- part of the class 532-570 series

Organic compounds

Heterocyclic carbon compounds containing a hetero ring...

C546S290000, C522S078000, C521S079000, C526S263000, C524S502000, C430S059500

Reexamination Certificate

active

06963001

ABSTRACT:
In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

REFERENCES:
patent: 3369058 (1968-02-01), Keenan
patent: 4670581 (1987-06-01), Tanigaki
patent: 4837197 (1989-06-01), Ikeda et al.
patent: 5427880 (1995-06-01), Tamura et al.
patent: 5723066 (1998-03-01), Coates et al.
patent: 5948847 (1999-09-01), Iguchi et al.
patent: 6046290 (2000-04-01), Berneth et al.
patent: 6143804 (2000-11-01), Uejyukkoku et al.
patent: 6229020 (2001-05-01), Shiono

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