Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate
2011-04-19
2011-04-19
Thomas, Tom (Department: 2893)
Semiconductor device manufacturing: process
Having diamond semiconductor component
Reexamination Certificate
active
07927915
ABSTRACT:
An opaque, low resistivity silicon carbide and a method of making the opaque, low resistivity silicon carbide. The opaque, low resistivity silicon carbide is doped with a sufficient amount of nitrogen to provide the desired properties of the silicon carbide. The opaque, low resistivity silicon carbide is a free-standing bulk material that may be machined to form furniture used for holding semi-conductor wafers during processing of the wafers. The opaque, low resistivity silicon carbide is opaque at wavelengths of light where semi-conductor wafers are processed. Such opaqueness provides for improved semi-conductor wafer manufacturing. Edge rings fashioned from the opaque, low resistivity silicon carbide can be employed in RTP chambers.
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Goela Jitendra S.
Pickering Michael A.
Harrison Monica D
Piskorski John J.
Rohm and Haas Company
Thomas Tom
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