Low resistance probe for semiconductor

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324158F, 324 725, G01R 100, G01R 104

Patent

active

051774380

ABSTRACT:
A probe (10) that can be used for forming a low resistance electrical connection to a semiconductor die includes a contact (18) that is created on a compliant layer (12) which is supported by a substrate (11). Pressure applied to the contact (18) compresses the compliant layer (11) which causes a distal end of the contact (18) to move in a motion that is substantially equal to an arc. As the contact (18) moves through the arc motion, it scrubs across a bonding pad of a semiconductor die and breaks through oxide that typically forms on the bonding pad thereby forming a low resistance electrical connection to the bonding pad.

REFERENCES:
patent: 4571542 (1986-02-01), Arai
patent: 4820976 (1989-04-01), Brown
patent: 4849689 (1989-07-01), Gleason et al.
patent: 5090118 (1992-02-01), Kwon et al.
patent: 5128612 (1992-07-01), Aton et al.

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