Stock material or miscellaneous articles – Composite – Of metal
Reexamination Certificate
2002-11-07
2004-06-29
Thibodeau, Paul (Department: 1773)
Stock material or miscellaneous articles
Composite
Of metal
C428S692100, C428S693100, C360S324000, C360S324100, C360S324200
Reexamination Certificate
active
06756128
ABSTRACT:
TECHNICAL FIELD
This invention relates to magnetic tunnel junction (MTJ) devices for memory, recording head and external magnetic field-sensing applications. More particularly the invention relates to a MTJ device that uses an improved insulating tunnel barrier that improves the properties of the MTJ.
BACKGROUND OF THE INVENTION
A magnetic tunnel junction (MTJ) is comprised of two layers of ferromagnetic material separated by a thin insulating tunnel barrier layer. The insulating layer is sufficiently thin that quantum-mechanical tunneling of the charge carriers occurs between the ferromagnetic electrodes. The tunneling process is electron spin dependent, which means that the tunneling current across the junction depends on the spin-dependent electronic properties of the ferromagnetic materials and the barrier layer and is a function of the relative orientation of the magnetic moments (magnetization directions) of the two ferromagnetic layers. The two ferromagnetic layers are designed to have different responses to magnetic fields so that the relative orientation of their moments can be varied with an external magnetic field. The MTJ is usable as a memory cell in a nonvolatile magnetic random access memory (MRAM) array, as described in IBM's U.S. Pat. No. 5,640,343, and as a magnetic field sensor, such as a magnetoresistive read head in a magnetic recording disk drive, as described in IBM's U.S. Pat. No. 5,729,410.
FIG. 1
illustrates a cross-section of a conventional MTJ device. The MTJ
10
includes a bottom “fixed” ferromagnetic (FM) layer
18
as the bottom magnetic electrode, an insulating tunnel barrier layer
20
, and a top “free” FM layer
32
as the top magnetic electrode. The MTJ
10
has bottom and top electrical leads,
12
,
14
, respectively, with the bottom lead
12
being formed on a suitable substrate. The FM layer
18
is called the “fixed” layer because its magnetic moment (magnetization direction) is prevented from rotation in the presence of applied magnetic fields in the desired range of interest for the MTJ device, i.e., the magnetic field caused by the write current applied to the memory cell from the read/write circuitry of the MRAM or the magnetic field from the recorded magnetic layer in a magnetic recording disk. The magnetic moment of FM layer
18
can be fixed by being formed of a high-coercivity material or by being exchange coupled to an antiferromagnetic layer. The fixed FM layer may also be the laminated or antiparallel (AP) pinned type of structure, as described in IBM's U.S. Pat. No. 5,465,185. The magnetic moment of the free FM layer
32
is not fixed, and is thus free to rotate in the presence of an applied magnetic field in the range of interest. In the absence of an applied magnetic field the moments of the FM layers
18
and
32
are aligned generally parallel (or antiparallel) in a MTJ memory cell and generally perpendicular in a MTJ magnetoresistive read head. The relative orientation of the magnetic moments of the FM layers
18
,
32
affects the tunneling current and thus the electrical resistance of the MTJ device.
An important parameter for MTJ device applications is high signal-to-noise ratio (SNR). The magnitude of the signal is dependent upon the magnetoresistance or MR (&Dgr;R/R) exhibited by the device. The magnetoresistance (MR) of a MTJ device is also referred to as the tunneling magnetoresistance (TMR). The signal is given by i
B
&Dgr;R, which is the bias current (i
B
) passing through the MTJ device (assuming a constant current is used to detect the signal) times the resistance change (&Dgr;R) of the device. However, the noise exhibited by the MTJ device is determined, in large part, by the resistance R of the device. Thus to obtain the maximum SNR for constant power used to sense the device the resistance (R) of the device must be small and the change in resistance (&Dgr;R) of the device large.
The resistance of a MTJ device is largely determined by the resistance of the insulating tunnel barrier layer for a device of given dimensions since the resistance of the electrical leads and the ferromagnetic layers contribute little to the resistance. Moreover, because the sense current passes perpendicularly through the ferromagnetic layers and the tunnel barrier layer, the resistance R of a MTJ device increases inversely with the area A of the device. The requirement for low resistance MTJ devices, coupled with the inverse relationship of resistance with area, is especially troublesome because an additional requirement for MTJ device applications is small area. For an MRAM the density of MTJ memory cells in the array depends on small area MTJs, and for a read head high storage density requires small data trackwidth on the disk, which requires a small area MTJ read head. Since the resistance R of a MTJ device scales inversely with the area A, it is convenient to characterize the resistance of the MTJ device by the product of the resistance R times the area A (RA). Thus RA is independent of the area A of the MTJ device.
In the prior art, the material used for the tunnel barrier layer is aluminum oxide (Al
2
O
3
) because such barrier layers can be made very thin and essentially free of pin holes or other defects. For Al
2
O
3
barrier layers it has been found that RA increases exponentially with the thickness of the layer. The thickness of Al
2
O
3
barrier layers can be varied over a sufficient range to vary RA by more than eight orders of magnitude, i.e., from more than 2×10
9
&OHgr;(&mgr;m)
2
to as little as 5 &OHgr;(&mgr;m)
2
. However, for these lower RA values, the TMR is typically reduced, in part because of microscopic pin holes or other defects in the ultra thin tunnel barrier layers needed to obtain these very low RA values. For MRAM applications RA values in the range 500-1000 &OHgr;(&mgr;m)
2
are acceptable, although it would be useful to be able to prepare MTJ memory cells with even lower RA values so that, for example, current could be passed perpendicularly through the MTJ cell to aid in the writing of the cell. Moreover, for scaling to ever higher memory capacities, MRAM cells will need to be shrunk in size, requiring lower RA values so that the resistance of the cell is not too high. More importantly, for MTJ read heads to be competitive in SNR with conventional giant magnetoresistance (GMR) spin-valve read heads, the MTJ heads need to have resistance values comparable to those of GMR heads. Since read heads of sub-micron size are required for high density recording applications, MTJ heads with RA values lower than 5 &OHgr;(&mgr;m)
2
are desirable, which is an RA value less than what can be obtained with Al
2
O
3
tunnel barriers.
U.S. Pat. No. 5,835,314 suggests that MTJ devices can be made with tunnel barriers formed of AlN, Si
3
N
4
, MgO, Ta
2
O
5
, TiO
2
, and Y
2
O
3
.
R. Jansen et al. (
J Appl. Phys
., 83, 11 (June 1998)) describe the effect of adding impurities such as Co, Pd, Cu or Ni into the middle of the insulating aluminum oxide barrier to affect the TMR. A single layer of aluminum oxynitride has been proposed as a tunnel barrier layer for reducing the resistance of the MTJ device in U.S. Pat. No. 6,183,859, and by M. Sharma et al. (
Appl. Phys. Lett
. 77, 14 (Oct. 2, 2000)).
The literature also describes other types of bilayers or multiple barriers being used in tunneling structures, but all of these are high resistance devices. De Teresa et al. (
Journal of Magnetism and Magnetic Materials
211, 160-166 (2000)) describes the dependence of the TMR effect on the magnetic layer/barrier interface, such as Co/Al
2
O
3
vs. Co/SrTiO
3
. Bilayer barriers, such as SrTiO
3
/Al
2
O
3
, were used to illustrate the effect of different interfaces on the two magnetic electrodes. P. K. Wong et al. (
J. Appl. Phys
. 83, 11 (Jun. 1, 1998)) prepared, as shown in Table 1, an MTJ device with a tunnel barrier of a bottom Al
2
O
3
/top MgO bilayer formed by sputter depositing Al/Mg in an oxygen atmosphere, but that device resulted in a high RA product of 1.2×10
8
&OHgr;(&mgr;m)
2
. Aga
Carey Matthew J.
Gurney Bruce A.
Ju Yongho
Berthold Thomas R.
International Business Machines - Corporation
Johnson Daniel E.
Thibodeau Paul
Uhlir Nikolas J
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