Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1978-11-09
1981-10-06
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
29590, 204192C, 228123, 427 91, 427 96, 427292, 427309, 4273833, 4273839, H01L 21285
Patent
active
042935873
ABSTRACT:
To provide an electrically conductive p-type wafer backside for semiconductor integrated circuit chips (die), a process is provided consisting of applying a thin layer of aluminum on a silicon dioxide free surface of the chip, followed by a layer of gold, then alloying the metals to diffuse the gold and traces of aluminum into the chip surface. The surface thus prepared can then be advantageously die attachable to a receiving surface by either eutectic alloy or conductive polymer techniques.
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patent: 3665594 (1972-05-01), Raithel
patent: 3702787 (1972-11-01), Lowry et al.
patent: 3729807 (1973-05-01), Fujiwara
patent: 3942244 (1976-03-01), Flohrs et al.
patent: 4012832 (1977-03-01), Crane
patent: 4023725 (1977-05-01), Ivett et al.
patent: 4181249 (1980-01-01), Peterson et al.
patent: 4233103 (1980-11-01), Shaheen
Smith John D.
Zilog Inc.
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