Low residue water-based soldering flux and process for soldering

Details Low residue water-based soldering flux and process for soldering Low residue water-based soldering flux and process for soldering

1994-02-28

1996-04-16

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 228223, B23K 3534

Patent

active

055078826

ABSTRACT:
Low residue water-based soldering flux, and process and system for using the same. The flux includes a mixture of succinic, glutaric and adipic acid in water, and optionally a wetting agent. The flux is applied to a surface to be soldered. The flux is dried. The surface is soldered. The flux is applied at an application station, dried at a drying station and soldered at a soldering station.

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patent: 5092943 (1992-03-01), Davis
patent: 5145722 (1992-09-01), Kaspaul
patent: 5281181 (1994-01-01), Stefanowski
patent: 5297721 (1994-03-01), Schneider et al.
"Europeans find ways to phase-out CFCs," Electronic Packaging & Production, vol. 29, No. 1, Jan. 1989, pp. 26 and 28.

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