Low residue soldering flux

Details Low residue soldering flux Low residue soldering flux

1990-05-04

1991-04-02

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 22, 148 24, 148 25, B23K 3534

Patent

active

050045091

ABSTRACT:
A low residue soldering flux contains a non-subliming dibasic acid mixture of by weight about 15-30% succinic acid, 40-63% glutaric acid and 10-30% adipic acid, e.g., in a volatilizable organic solvent, formed as a rosin-containing or rosin-free flux. The dibasic acid mixture is capable of volatilizing during heat soldering to leave a soldered product (e.g., an electronic circuit board) essentially free from corrosion-promoting ionic residue. This eliminates the need for a residue-removing washing step.

REFERENCES:
patent: 2898255 (1959-08-01), Thompson
patent: 4149931 (1980-03-01), Zado

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