Low profile wire bond for an electron sensing device in an...

Details Low profile wire bond for an electron sensing device in an... Low profile wire bond for an electron sensing device in an...

2006-11-21

2008-09-30

Pyo, Kevin (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

C250S207000

Reexamination Certificate

active

07429724

ABSTRACT:
An electron sensing device for receiving electrons from an output surface of an electron gain device includes a silicon die having an active surface area for positioning below the output surface of the electron gain device. An array of first bond pads is disposed on a periphery of the active surface area of the silicon die. A ceramic carrier is positioned below the silicon die, including a second array of bond pads disposed on the ceramic carrier and arranged in a substantially vertical alignment to the first array of bond pads. A plurality of conductive via holes is disposed in the ceramic carrier for electrically connecting the first array of bond pads to the second array of bond pads. When the imager is positioned below the electron gain device, a tight vertical clearance is formed between the output surface of the electron gain device and the active surface area of the electron sensing device.

REFERENCES:
patent: 5506402 (1996-04-01), Estrera et al.
patent: 5581151 (1996-12-01), Wheeler et al.
patent: 5633493 (1997-05-01), Suzuki et al.
patent: 6281572 (2001-08-01), Robbins
patent: 6583558 (2003-06-01), Suyama et al.
patent: 6724131 (2004-04-01), Iosue
patent: 2007/0023617 (2007-02-01), Thomas

Affiliated with

Also associated with

Rating

Low profile wire bond for an electron sensing device in an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low profile wire bond for an electron sensing device in an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile wire bond for an electron sensing device in an... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3990019