Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2007-06-19
2007-06-19
Duong, Tho (Department: 3744)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C361S699000
Reexamination Certificate
active
11087402
ABSTRACT:
This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.
REFERENCES:
patent: 5587880 (1996-12-01), Phillips et al.
patent: 5761037 (1998-06-01), Anderson et al.
patent: 5940270 (1999-08-01), Puckett
patent: 5953930 (1999-09-01), Chu et al.
patent: 6388882 (2002-05-01), Hoover et al.
patent: 6687122 (2004-02-01), Monfarad
patent: 6840311 (2005-01-01), Ghosh et al.
patent: 6981543 (2006-01-01), Chesser et al.
patent: 2001/0023757 (2001-09-01), Huang
patent: 2001/0046119 (2001-11-01), Hamano et al.
patent: 2002/0179284 (2002-12-01), Joshi et al.
patent: 2003/0051859 (2003-03-01), Chesser et al.
patent: 2005/0056403 (2005-03-01), Norlin et al.
Beitelmal et al. (2002) “Two Phase Loop: Compact Thermosyphon,” Hewlett-Packard Company Publication.
Joshi, Y. “Heat Out of Small Packages,” http://www.memagazine.org/backissues/dec01/features/heatout.html.
Joshi et al. (2002) “Emerging Thermal Challenges in Electronics Driven by Performance, Reliability and Energy Efficiency,” Georgia institute of technology, Microelectronics and emerging technologies thermal laboratory.
Khrustalev, D. “Loop Thermosyphons for cooling of Electronics,” http://www.thermacore.com/pdfs/thermosyphons.pdf.
Thermacore “Therma-Loop: Loop Heat Pipes and Loop Thermosyphons,” http://www.thermacore.com/thermaloop.htm.
Thermacore “Mobile Processor Cooling with Remote Heat Exchanger,” http://www.thermacore.com/therm—port.htm.
TS Heatronics Co. “new Heat Transfer Technology—Heatlane,” http://tsheatronics.com.jp/english/technology/index.html.
Zuo et al. (2002) “Advanced Thermal Architecture for Cooling of High Power Electronics,”Thermacore.
Alex Belits
Valeriy Belits
Belits Computer systems, Inc.
Duong Tho
Greenlee Winner and Sullivan PC
LandOfFree
Low-profile thermosyphon-based cooling system for computers... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low-profile thermosyphon-based cooling system for computers..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-profile thermosyphon-based cooling system for computers... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3836194