Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-11-26
1999-11-16
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29825, 29841, 29842, 22818021, 22818022, H01R 900
Patent
active
059834927
ABSTRACT:
A connector for microelectronic elements includes electrically conductive, elongated leads having contact portions underlying a compliant layer. The contact portion of each lead overlies a pedestal portion of the compliant layer. The pedestal portion is at least partially isolated from the remaining portion of the compliant layer by gaps in the compliant layer. The pedestals may thus deflect horizontally, compensating for relative movement between the connector and the microelectronic element. Portions of the leads spanning the gaps may be curved to facilitate deflection. The pedestals may be attached to a substrate having terminals. A terminal end of each lead is then electrically connected to the terminal in the substrate, either through a plated through-hole, or by bending downward and bonding. The pedestals may support a plurality of leads along their length. Alternatively, the pedestals may support only a single respective lead, in which case the pedestal is isolated from neighboring pedestals and may deflect in a plurality of horizontal directions.
REFERENCES:
patent: 3275736 (1966-09-01), Hotine et al.
patent: 3509270 (1970-04-01), Dube et al.
patent: 3616532 (1971-11-01), Beck
patent: 3670409 (1972-06-01), Reimer
patent: 3797103 (1974-03-01), Desmond et al.
patent: 3818415 (1974-06-01), Evans et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 3998377 (1976-12-01), Metz
patent: 4121044 (1978-10-01), Hadersbeck et al.
patent: 4283839 (1981-08-01), Gursky
patent: 4295596 (1981-10-01), Doten et al.
patent: 4557043 (1985-12-01), Starski
patent: 4597617 (1986-07-01), Enochs
patent: 4655519 (1987-04-01), Evans et al.
patent: 4658332 (1987-04-01), Baker et al.
patent: 4695870 (1987-09-01), Patraw
patent: 4696096 (1987-09-01), Green et al.
patent: 4716049 (1987-12-01), Patraw
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4846704 (1989-07-01), Ikeya
patent: 4847146 (1989-07-01), Yeh et al.
patent: 4887760 (1989-12-01), Yoshino et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4902606 (1990-02-01), Patraw
patent: 4913336 (1990-04-01), Yamazaki
patent: 4924353 (1990-05-01), Patraw
patent: 4937006 (1990-06-01), Bickford et al.
patent: 4950173 (1990-08-01), Minemura et al.
patent: 4950623 (1990-08-01), Dishon
patent: 4970624 (1990-11-01), Arneson et al.
patent: 4975079 (1990-12-01), Beaman et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5006917 (1991-04-01), Kang et al.
patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5053922 (1991-10-01), Matta et al.
patent: 5057969 (1991-10-01), Ameen et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5115964 (1992-05-01), Ameen et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5181859 (1993-01-01), Foreman et al.
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5199879 (1993-04-01), Kohn et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5281684 (1994-01-01), Moore et al.
patent: 5282565 (1994-02-01), Melton
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5343366 (1994-08-01), Cipolla et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5349495 (1994-09-01), Visel et al.
patent: 5349500 (1994-09-01), Casson et al.
patent: 5354205 (1994-10-01), Feigenbaum et al.
patent: 5459287 (1995-10-01), Swamy
patent: 5463191 (1995-10-01), Bell et al.
patent: 5476211 (1995-12-01), Khondros
patent: 5587885 (1996-12-01), Swamy
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5832601 (1998-11-01), Eldridge et al.
patent: 5848467 (1998-12-01), Khandros et al.
Multi-Chip Module Technologies and Alternatives: The Basics, Donn et al. EDS Van Nostrand Rhinehold Company 1993, Chapter 10 (patent prosecution. 487-524).
TRW Data Technologies 1994 Brochure.
Design News, Jan. 17, 1994, "Tiny Filter Quashes EMI"(1 page).
Supplementary Interconnection Devices, Ginsberg et al., Multichip Modules and Related Technologies (pp. 201-229).
"A Tab Tape-Based Bare Chip Test and Burn-In Carrier", Nolan et al. 1994 ITAP & Flip Chip Procceedings (pp. 173-179).
"Mechanical Interconnection System for Solder Bump Dice", Hill et al., 1994 ITAP & Flip Chip Proceedings (pp. 82-86).
Electronic Buyers' News, Issue 867, Aug. 16, 1993, "Quieting Connectors Down" by David Gabel.
"MCM To Printed Wiring Board (Second Level) Connection Technology Options" Alan D. Knight, Multichip Module Technologies and Alternatives: The Basics (pp. 504-509; 521-523).
IEE Transaction on Components, Packaging and Manufacturing Technology, Part A, vol. 18, No. 2. Jun. 1995, "Constriction Resistance of Microcone-Based Contacts".
"Design for Minimum Chip Joint Stress," IBM Technical Disclosure Bulletin, vol. 32, No. 7, Dec. 1989.
"Improved C4 Reliability Using Low Modulus Dielectric Layer, " IBM Technical Disclosure Bulletin, vol. 32, No. 6A, Nov. 1989.
Arbes Carl J.
Tessera Inc.
LandOfFree
Low profile socket for microelectronic components and method for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low profile socket for microelectronic components and method for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile socket for microelectronic components and method for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1308874