Low-profile removable ball-grid-array integrated circuit package

Details Low-profile removable ball-grid-array integrated circuit package Low-profile removable ball-grid-array integrated circuit package

1997-07-25

1999-09-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438108, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

059500727

ABSTRACT:
An integrated circuit package had leadless solderballs attached to the substrate with a conductive thermoplastic adhesive. The leadless solderballs are preferably made with a copper-nickel-gold alloy. The conductive thermoplastic is preferably of the silver fill type. The integrated circuit package is placed in a frame and held to the printed circuit board with a clamp or with a screw.

REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5357672 (1994-10-01), Newman
patent: 5362679 (1994-11-01), Wakefield
patent: 5376010 (1994-12-01), Petersen
patent: 5400220 (1995-03-01), Swamy
patent: 5419710 (1995-05-01), Pfaff
patent: 5436503 (1995-07-01), Kunitomo et al.
Alphametals Technical Bulletin: "Application of Staystik 101 (paste) $ 501 (film) High Temperature Thermoplastics in Hermetic Ceramic Packages".

Affiliated with

Also associated with

Rating

Low-profile removable ball-grid-array integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low-profile removable ball-grid-array integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-profile removable ball-grid-array integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1814524