Low-profile removable ball-grid-array integrated circuit package

Details Low-profile removable ball-grid-array integrated circuit package Low-profile removable ball-grid-array integrated circuit package

1995-07-28

1998-02-03

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257737, 257780, H01C 2348, H01C 2352, H01C 2940

Patent

active

057148031

ABSTRACT:
An integrated circuit package has leadless solderballs attached to the substrate with a conductive thermoplastic adhesive. The leadless solderballs are preferably made with a copper-nickel-gold alloy. The conductive thermoplastic is preferably of the silver fill type. The integrated circuit package is placed in a frame and held to the printed circuit board with a clamp or with a screw.

REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5357672 (1994-10-01), Newman
patent: 5362679 (1994-11-01), Wakefield
patent: 5376010 (1994-12-01), Petersen
patent: 5400220 (1995-03-01), Swamy
patent: 5419710 (1995-05-01), Pfaff
patent: 5436503 (1995-07-01), Kunitomo et al.
Alphametals Technical Bulletin: "Application of Staystik 101 (paste) & 501 (film) High Temperature Thermoplastics in Hermetic Ceramic Packages".

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